The NATIONAL E&E FORUM 2024, organized by the Malaysia Semiconductor Industry Association (MSIA) and supported by the Electrical & Electronics Productivity Nexus (EEPN), MPC, brought together industry leaders to discuss advancements in IC design, AI innovation, and advanced packaging.
Key highlights included:
▪️Introductory speech by Dato’ Seri Wong Siew Hai, President of MSIA & EEPN Champion.
▪️Keynote Address by YB Liew Chin Tong, Deputy Minister of MITI.
▪️MOU Signing Ceremony for Malaysia’s first locally developed Edge AI System by SkyeChip, Elliance, Kaltech, and Estek Automation.
▪️Panel Discussions featuring industry experts from Arm Taiwan, SkyeChip, Intel Malaysia, IBM ASEAN, Accenture, Microsoft, YOLE Group, NXP Semiconductors, Lam Research, and STMicroelectronics, tackling the latest in IC design, AI transformation, and advanced packaging.
This impactful event showcased strategic collaborations shaping the future of Malaysia’s E&E sector. 💡
#EEForum2024 #InnovationForTomorrow #NationalSemiconductorStrategy #CollaborationForGrowth”